What's in the box:
1 X Kingston HyperX Impact Black 4GB 1866MHz DDR3L Laptop RAM (Low Voltage - HX318LS11IB/4)
HyperX HX318LS11IB/8 is a 1G x 64-bit (8GB) DDR3L-1866 CL11 SDRAM (Synchronous DRAM) 2Rx8, low voltage, memory modules, based on sixteen 512M x 8-bit DDR3 FBGA components. This module has been tested to run at DDR3L-1866 at a
low latency timing of 11-11-11 at 1.35V or 1.5V. Additional timing parameters are shown in the PnP Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows:
CL(IDD) 11 cycles
Row Cycle Time (tRCmin) 44.7ns (min.)
Refresh to Active/Refresh 260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 34ns (min.)
Maximum Operating Power TBD W* @1.35V
UL Rating 94 V - 0
Operating Temperature 0oC to 85o C
Storage Temperature -55o C to +100o C
• JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V) Power Supply
• VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)
• 933MHz fCK for 1866Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 13, 11, 10, 9, 8, 7, 6, 5
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
• Bi-directional Differential Data Strobe • Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset • PCB : Height 1.180” (30.00mm), double sided component.
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