What's in the box& 58
HyperX HX316C9SR/8 is a 1G x 64-bit (8GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 2Rx8, memory module, based on sixteen 512M x 8-bit FBGA components per module. Each module supports Intel® XMP (Extreme Memory Profiles). Each module has been tested to run at DDR3-1600 at a low latency timing of 9-9-9 at 1.5V. The SPDs are programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. Each 240-pin DIMM uses gold contact fingers. The JEDEC standard electrical and mechanical specifications are as follows:
â€¢ JEDEC standard 1.5V (1.425V ~ 1.575V) Pow 01r Supply
â€¢ VDDQ = 1.5V (1.425V ~ 1.575V)
â€¢ 800MHz fCK for 1600Mb/sec/pin
â€¢ 8 independent internal banks
â€¢ Programmable CAS latency: 11, 10, 9, 8, 7, 6
â€¢ Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
&n sp; â€¢ 8-bit pre-fetch
â€¢ Burst Length: 8 (interleave without any limit, sequential with
starting address â€œ000â€ only), 4 with tCCD = 4 which does not
allow seamless read or write (either on the fly using A12 or MRS)
&aci #114c;€¢ Bi-directional Differential Data Strobe
â€¢ Internal (self) calibration: Internal self calibration through ZQ
pin (RZQ: 240 ohm ± 1%)
â€¢ On Die Termination using ODT pin
â€¢ Average Refresh Period 7.8us at lower than TCASE 85°C,
#38nbsp; 3.9us at 85°C â€¢ Asynchronous Reset
â€¢ Height 1.311â€ (33.30mm), w/heatsink, double sided component
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